{"id":7199,"date":"2022-07-08T08:59:36","date_gmt":"2022-07-08T06:59:36","guid":{"rendered":"https:\/\/www.tpv-automotive.si\/en\/?page_id=7199"},"modified":"2022-07-08T09:12:52","modified_gmt":"2022-07-08T07:12:52","slug":"dais","status":"publish","type":"page","link":"https:\/\/www.tpv-automotive.si\/en\/about-us\/research-and-development-projects\/dais\/","title":{"rendered":"DAIS"},"content":{"rendered":"<div id='av_section_1'  class='avia-section main_color avia-section-no-padding avia-shadow avia-bg-style-scroll  avia-builder-el-0  el_before_av_one_full  avia-builder-el-first   av-minimum-height av-minimum-height-custom  container_wrap fullsize' style='background-repeat: repeat-x; background-image: url(https:\/\/www.tpv-automotive.si\/en\/wp-content\/uploads\/sites\/3\/2020\/09\/About_us-RDP-Header.jpg);background-attachment: scroll; background-position: top center;  '  data-section-bg-repeat='repeat-x'><div class='container' style='height:240px'><main  role=\"main\" itemprop=\"mainContentOfPage\"  class='template-page content  av-content-full alpha units'><div class='post-entry post-entry-type-page post-entry-7199'><div class='entry-content-wrapper clearfix'>\n<div  style='height:100px' class='hr hr-invisible   avia-builder-el-1  el_before_av_textblock  avia-builder-el-first '><span class='hr-inner ' ><span class='hr-inner-style'><\/span><\/span><\/div>\n<section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  av_inherit_color '  style='color:#ffffff; '  itemprop=\"text\" ><h2>DAIS<\/h2>\n<\/div><\/section>\n<\/div><\/div><\/main><!-- close content main element --><\/div><\/div><div id='after_section_1'  class='main_color av_default_container_wrap container_wrap fullsize' style=' '  ><div class='container' ><div class='template-page content  av-content-full alpha units'><div class='post-entry post-entry-type-page post-entry-7199'><div class='entry-content-wrapper clearfix'><div class=\"flex_column av_one_full  flex_column_div av-zero-column-padding first  avia-builder-el-3  el_after_av_section  el_before_av_two_third  avia-builder-el-first  \" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><blockquote>\n<h5><strong>DAIS, Slovenia<br \/>\n<\/strong>Distributed Artificial Intelligent Systems<\/h5>\n<\/blockquote>\n<\/div><\/section><\/div><\/p>\n<div class=\"flex_column av_two_third  flex_column_div av-zero-column-padding first  avia-builder-el-5  el_after_av_one_full  el_before_av_one_third  column-top-margin\" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><p><strong>Distributed Artificial Intelligent Systems \u2013 DAIS<\/strong><\/p>\n<p><em>A pan-European project bringing faster, more secure and energy-efficient data processing solutions through the development of edge AI software and hardware components.<\/em><\/p>\n<p>With the revolutionary change brought on by the Internet of Things (IoT) and the rapid increase of data from more and more ubiquitous connected devices, the vulnerabilities in the system have been brought to the forefront. How can we collect and process the ever-growing amount of data while also addressing the challenges regarding privacy, speed and energy efficiency? And how can Europe take the lead in a domain which is already predominated by America and Asia? These are some of the questions which the project\u00a0<strong>Distributed Artificial Intelligent Systems (DAIS)<\/strong>\u00a0is looking to answer.<\/p>\n<p>DAIS is a pan-European effort spanning three years with a total budget of\u00a0<strong>\u20ac33 million<\/strong>\u00a0and a consortium of\u00a0<strong>47<\/strong>\u00a0partners from\u00a0<strong>11<\/strong>\u00a0countries. Coordinated by RISE, a research institute of Sweden, the project will strengthen Europe\u2019s position by putting European values at the core of the Electronic Components and Systems (ECS) that will shape a new era by self-organization, privacy by design, low use of energy and delivering the technology needed to protect these values.<\/p>\n<\/div><\/section><\/div>\n<div class=\"flex_column av_one_third  flex_column_div av-zero-column-padding   avia-builder-el-7  el_after_av_two_third  el_before_av_one_full  column-top-margin\" style='border-radius:0px; '><div  class='avia-image-container  av-styling-    avia-builder-el-8  avia-builder-el-no-sibling  avia-align-center '  itemprop=\"image\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/ImageObject\"  ><div class='avia-image-container-inner'><div class='avia-image-overlay-wrap'><img class='avia_image' src='https:\/\/www.tpv-automotive.si\/en\/wp-content\/uploads\/sites\/3\/2022\/07\/About_us-RDP-DAIS-Main.jpg' alt='' title='About_us - RDP - DAIS - Main' height=\"779\" width=\"735\"  itemprop=\"thumbnailUrl\"  \/><\/div><\/div><\/div><\/div>\n<div class=\"flex_column av_one_full  no_margin flex_column_div av-zero-column-padding first  avia-builder-el-9  el_after_av_one_third  el_before_av_one_full  column-top-margin\" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><p><strong>AI at the edge \u2013 prerequisites for DAIS<\/strong><\/p>\n<p>The new paradigm of<strong>\u00a0Edge Computing<\/strong>\u00a0provides new solutions by bringing resources closer to the user, keeps sensitive &amp; private data on device, and provides low latency, energy efficiency, and scalability compared to cloud services while also reducing the network bandwidth. At the same time, there is an increasing need to use\u00a0<strong>Artificial Intelligence (AI)<\/strong>\u00a0at the edge. The bringing together of these innovations and the subsequent migration of the AI functions from the cloud to the edge will serve as the next step in the evolution where the DAIS project will be a major contributor. In the future\u00a0<strong>Edge Intelligence<\/strong><strong>\u00a0scenario<\/strong>, advanced AI and machine learning algorithms will be optimized to run on the edge capable of dealing features like video frames, natural speech information, and unstructured data generated by cameras, microphones, and other sensors without uploading data to the cloud and waiting for the response.<\/p>\n<\/div><\/section><\/div>\n<div class=\"flex_column av_one_full  no_margin flex_column_div av-zero-column-padding first  avia-builder-el-11  el_after_av_one_full  el_before_av_one_full  column-top-margin\" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><p><strong>DAIS objective \u2013 Competitiveness for a strong European Industry<\/strong><\/p>\n<p>DAIS has ambitious objective to develop\u00a0<strong>intelligent<\/strong>\u00a0and\u00a0<strong>secure Edge<\/strong>\u00a0solutions for\u00a0<strong>industrial applications<\/strong>\u00a0for European industry throughout the whole Supply Chain.<\/p>\n<p>More precisely DAIS aims at:<\/p>\n<ul>\n<li>Providing\u00a0<strong>intelligent processing<\/strong>of data and communication locally\u00a0<strong>at the edge<\/strong>\u00a0to enable real-time and safety-critical industrial applications.<\/li>\n<li>Developing industrial-grade\u00a0<strong>secure<\/strong>,\u00a0<strong>safe<\/strong>and\u00a0<strong>reliable<\/strong>\u00a0HW and SW solutions that can cope with cyberattacks and difficult network conditions.<\/li>\n<li>Providing\u00a0<strong>AI techniques on the edge<\/strong>that match with diverse computing powers contrary to relatively consistent computing power on the cloud.<\/li>\n<li><strong>Distributing and dividing the complex AI operations between the cloud and edge<\/strong>, with edge undertaking early intelligent data processing reducing the bandwidth of data being transmitted to cloud; and building the infrastructure (including hardware and software) to provide for this in Europe.<\/li>\n<li>Providing data sharing and collaborating solutions on the edge to handle the temporal-spatial diversity of edge data.<\/li>\n<li>Developing solutions for\u00a0<strong>IoT<\/strong>, i.e., mostly wireless devices with energy- and processing- constraints, for heterogeneous and hostile\/harsh environments.<\/li>\n<li>Providing re-usable solutions\u00a0<strong>across industrial domains<\/strong>.<\/li>\n<\/ul>\n<p>Using a methodological approach with the\u00a0<strong>Integral Supply Chain<\/strong>, from academic, to system designers and integrators, to component providers, applications and services developers &amp; providers and end users.<\/p>\n<\/div><\/section><\/div>\n<div class=\"flex_column av_one_full  no_margin flex_column_div av-zero-column-padding first  avia-builder-el-13  el_after_av_one_full  el_before_av_one_third  column-top-margin\" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><p><strong>Overall DAIS concept<\/strong><\/p>\n<p>In order to achieve and validate the stated impact, the DAIS consortium has defined so-called supply chains (SC). Each supply chain addresses a specific DAIS objective, and its results are used as input to other supply chains and project activities.\u00a0<strong>DAIS<\/strong>\u00a0defines two types of supply chains:<\/p>\n<ul>\n<li><strong>The enabling technology supply chains<\/strong>(SC 1-5) develop the fundamental core software and hardware technology elements (such as components, systems and architectures) required by other supply chains (6-8).<\/li>\n<li><strong>The application supply chains<\/strong>(SC 6-8) will\u00a0<strong>apply<\/strong>\u00a0and\u00a0<strong>validate<\/strong>\u00a0the results achieved in the enabling technology supply chains. The advancements achieved during the DAIS project will be showcased by dedicated demonstrators of the supply chains 6-8.<\/li>\n<\/ul>\n<p>Every effort and activity of a specific partner in a supply chain is mapped into work packages, starting with requirements and ending with validation and test. The matrix structure supports the effective and efficient collaboration between the partners in a focused manner.<\/p>\n<p>DAIS has received funding from the ECSEL Joint Undertaking (JU) under Grant agreement number: 101007273. The JU receives support from the European Union\u2019s Horizon 2020 research and innovation programme and Sweden, Netherlands, Germany, Spain, Denmark, Norway, Portugal, Belgium, Slovenia, Czech Republic, Turkey.<\/p>\n<\/div><\/section><\/div>\n<div class=\"flex_column av_one_third  flex_column_div av-zero-column-padding first  avia-builder-el-15  el_after_av_one_full  el_before_av_two_third  column-top-margin\" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><p><strong>Partners:<\/strong> 47 partnerjev iz vse Europe<\/p>\n<p><strong>Head partner:<\/strong>\u00a0 \u00a0RISE Institute Sweeden<\/p>\n<p><strong>Slovenia:<\/strong> Institut Jo\u017eef \u0160tefan, COSYLAB, TPV AUTOMOTIVE<\/p>\n<p><strong>Project value:<\/strong> 32.739.483 EUR<\/p>\n<p><strong>Maximum co-financing value:<\/strong> 9.815.698,94 EUR<\/p>\n<p><strong>Start of project:<\/strong> Maj 2021<\/p>\n<p><strong>More about the\u00a0 project: <\/strong><a href=\"https:\/\/dais-project.eu\/\">https:\/\/dais-project.eu\/<\/a><\/p>\n<\/div><\/section><\/div>\n<div class=\"flex_column av_two_third  flex_column_div av-zero-column-padding   avia-builder-el-17  el_after_av_one_third  avia-builder-el-last  column-top-margin\" style='border-radius:0px; '><div  class='avia-image-container  av-styling-    avia-builder-el-18  avia-builder-el-no-sibling  avia-align-center '  itemprop=\"image\" itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/ImageObject\"  ><div class='avia-image-container-inner'><div class='avia-image-overlay-wrap'><img class='avia_image' src='https:\/\/www.tpv-automotive.si\/en\/wp-content\/uploads\/sites\/3\/2022\/07\/About_us-RDP-DAIS-Infografika-1030x310.png' alt='' title='About_us - RDP - DAIS - Infografika' height=\"310\" width=\"1030\"  itemprop=\"thumbnailUrl\"  \/><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":0,"parent":4597,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-7199","page","type-page","status-publish","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.3.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>DAIS - TPV Automotive EN<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.tpv-automotive.si\/en\/about-us\/research-and-development-projects\/dais\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"DAIS - TPV Automotive EN\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.tpv-automotive.si\/en\/about-us\/research-and-development-projects\/dais\/\" \/>\n<meta property=\"og:site_name\" content=\"TPV Automotive EN\" \/>\n<meta property=\"article:modified_time\" content=\"2022-07-08T07:12:52+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"11 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.tpv-automotive.si\/en\/about-us\/research-and-development-projects\/dais\/\",\"url\":\"https:\/\/www.tpv-automotive.si\/en\/about-us\/research-and-development-projects\/dais\/\",\"name\":\"DAIS - 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